Chip molding compounds, high-frequency copper clad laminates, electronic thermal conductive adhesives, thermal conductive pads, fillers for PCB ink, electronic ceramic substrates, and insulating encapsulation of precision electronic components.
Coating fillers for lithium battery cathode, anode and separators; photovoltaic encapsulant adhesives; thermal conductive materials for energy storage; high thermal conductivity ceramic substrates and thermal conductive gels for high-power components.
Thermal conductive pads and gels for servers, thermal conductive plastics, high thermal conductivity ceramic substrates.