Manufactured via processes including melting compounding, ultrafine grinding and surface treatment with various mineral raw materials. Suitable for lead-free, halogen-free copper clad laminates with medium and high Tg.
Electronic-grade powder featuring stable chemical properties, excellent acid and alkali resistance, low coefficient of thermal expansion and moderate hardness.
Low hardness, reduces drill bit abrasion.
Manufactured via processes including melting compounding, ultrafine grinding and surface treatment with various mineral raw materials. Suitable for lead-free, halogen-free copper clad laminates with medium and high Tg.
Electronic-grade powder featuring stable chemical properties, excellent acid and alkali resistance, low coefficient of thermal expansion and moderate hardness.
Low hardness, reduces drill bit abrasion.
Typical data
|
Test items |
Unit |
GK10 |
GK50 |
GK70 |
Test method |
|
|
Composition |
SiO2 |
% |
61.50 |
XRF |
||
|
Al2O3 |
% |
17.72 |
||||
|
Fe2O3 |
% |
0.02 |
||||
|
Particle size |
D50 |
μm |
3.7 |
1.8 |
2.3 |
Laser Particle Sizer |
|
D99 |
μm |
9.6 |
5.2 |
6.5 |
||
|
pH |
—— |
8.4 |
8.2 |
7.9 |
pH Analyzer |
|
|
Mohs hardness |
—— |
5 |
Theoretical Value |
|||
Typical data
|
Test items |
Unit |
GK10 |
GK50 |
GK70 |
Test method |
|
|
Composition |
SiO2 |
% |
61.50 |
XRF |
||
|
Al2O3 |
% |
17.72 |
||||
|
Fe2O3 |
% |
0.02 |
||||
|
Particle size |
D50 |
μm |
3.7 |
1.8 |
2.3 |
Laser Particle Sizer |
|
D99 |
μm |
9.6 |
5.2 |
6.5 |
||
|
pH |
—— |
8.4 |
8.2 |
7.9 |
pH Analyzer |
|
|
Mohs hardness |
—— |
5 |
Theoretical Value |
|||