
Chip molding compounds, high-frequency copper clad laminates, electronic thermal conductive adhesives, thermal conductive pads, fillers for PCB ink, electronic ceramic substrates, and insulating encapsulation of precision electronic components.
Chip molding compounds, high-frequency copper clad laminates, electronic thermal conductive adhesives, thermal conductive pads, fillers for PCB ink, electronic ceramic substrates, and insulating encapsulation of precision electronic components.